RIO,
Inc. to Demonstrate New High-Performance Low-Cost TOSA for
80 km 10 Gb/s
Santa Clara, CA, March
3, 2005 – RIO, Inc. (Redfern
Integrated Optics) will showcase at next week’s OFC/NFOEC
2005 conference (booth #2756) a small format TOSA based on
a new type of directly modulated laser, which uses Planar External-Cavity
(PLANEX) Laser technology. The physical interface of the TOSA
is compliant with the XFP Miniature Device Multi-Source Agreement
(XMD MSA). Applications include: SONET OC192 IR-2/LR-2c, SDH64
S64.2a,b/L64.2c, 10GbE 10GBASE-ER/EW/ZR, Fiber Channel, and
others.
The TOSA leverages the advantages of
RIO’s PLANEX technology
to deliver high performance, comparable with externally modulated
lasers, combined with the low cost and simplicity of directly
modulated lasers, to provide the industry’s lowest cost
per port for 10 Gb/s over 80 km of SMF-28 fiber. Primary benefits
include:
* Low-cost, high volume solution for 10 Gb/s optical interfaces
* 80 km transmission without dispersion compensation at 1550
nm
* High output power and low power dissipation
* Excellent wavelength stability to support DWDM requirements
with high yield and low cost.
According to Radu Barsan, President and
CEO of RIO Inc., “Monolithic
or hybrid integrated electroabsorption modulated lasers (EMLs)
are expensive, especially for distances up to 80 km, and prohibitively
expensive for narrow grid DWDM. In contrast, by leveraging
pre-tested, low-cost silicon-based Planar Lightwave Circuit
(PLC) components, a simple design, and volume-oriented assembly
processes, RIO’s approach offers significant manufacturing
cost reduction, while meeting or exceeding the high-performance
and reliability requirements of Telecom standards. In addition,
postponing the wavelength decision until the packaging step
significantly reduces the cost and lead time for delivering
DWDM devices.”
Leveraging the advantages of the PLANEX integration approach,
RIO manufactures the PLC components in its silica-on-silicon
wafer fabrication facility and outsources all other components
and manufacturing steps.
A number of leading developers of optical
networking transceivers and systems have been tracking the
development of RIO’s
PLANEX-based technology over the past two years. Manufacturers
such as Sumitomo Electric Industries, Ltd. have already evaluated
early devices during 2004 and are actively testing samples
of the new TOSAs in order to leverage the best available technology
for next-generation product offerings.
According to Shigeru Inano, R&D Director at Innovation
Core SEI, Inc. (a Sumitomo Electric Company), “The growing
demand for 40km and 80km 10 Gb/s optical interfaces and the
growth of DWDM are stepping up the pressure on transceiver
designs. A high-performance low-cost, volume oriented approach
at the TOSA level, such as RIO’s, will be critical to
achieving the economics needed to support widespread deployment
of 10 Gb/s transmission over 80 km and DWDM.”
Demonstrations of new PLANEX-based TOSAs
can be seen at RIO’s
booth #2756 during regular exhibit floor hours at OFC from
March 8 through March 10.
About RIO Inc.
RIO Inc. is an industry leader in the development of new semiconductor
and optical transmission technologies that enable transceivers
to deliver telecom-grade performance with datacom economics.
RIO is headquartered in Santa Clara, CA, with PLC wafer fabrication
facilities in Sydney, Australia.
For more information, please visit www.rio-inc.com.
For More Information, contact
Radu Barsan, President and CEO
408-970-3500 ext.350
Jim Hunt
Phone: 253-857-7242
Email: jimhunt@sitmark.com
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